发明名称 CIRCUIT BOARD AND ITS MANUFACTURE
摘要 PURPOSE:To provide a circuit board which has an insulating layer and shield layer having uniform thickness, does not cause any insufficient insulation, and is high in electromagnetic shielding effect and the manufacturing method of the circuit board. CONSTITUTION:This circuit board includes conductor 2 provided on a substrate 1, a first insulating film 4 coating the conductors 2, and a conductive film 3 coating the first insulating film 4. At least one of the films 4 and 3 is formed by an electrodeposition coating method.
申请公布号 JPH04211189(A) 申请公布日期 1992.08.03
申请号 JP19910058817 申请日期 1991.03.22
申请人 CANON INC 发明人 SUMIKURA SUSUMU
分类号 C25D13/00;C09D5/44;H05K1/02;H05K1/09;H05K3/28;H05K3/46;H05K9/00 主分类号 C25D13/00
代理机构 代理人
主权项
地址