| 摘要 |
PURPOSE: To improve the adhesion of metal adhered to a polyimide surface in a plating process by pre-treating the polyimide surface during adjustment for the adhesion improving treatment of the polyimide surface and the later metal coating treatment. CONSTITUTION: A polyimide surface is brought into contact with aqueous solution nitrate having about 35-70weight% concentration or aqueous solution hydrochloride having about 10-38weight% concentration (A), this acid treated polyimide surface is rinsed with water, and acid is substantially removed from the polyimide surface (B), this rinsed polyimide surface is brought into contact with mild etchant, and a residual film is formed on the polyimide surface (C), this etched polyimide surface is brought into contact with basic solution (D), and the residual film formed on the polyimide surface after the polyimide surface is brought into the mild etchant in the step C is removed (E).
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