| 摘要 |
<p>PURPOSE:To reduce the manufacturing period and increase the yield and reliability of a multilayered wiring board for high-purity mounting. CONSTITUTION:After a multilayered substrate is formed including a resist and metallic base layers, multilayered wiring of a skeleton structure is formed by collectively removing the resist and metallic base layers. After the wiring is formed, this multilayered wiring board is formed by forming an insulating layer by filling up the space of the multilayered wiring with solventless vanish. Therefore, the manufacturing period required by a module and computer can be reduced and the yield and reliability of the board can be improved. In addition, the operating speed of the computer can be increased.</p> |
