| 摘要 |
PURPOSE:To obtain criteria of setting gaps between electrode pads by a method wherein an average gap between electrode pads arranged with gaps narrower than those between leads on a device chip facing a plurality of electrode extraction leads is set by a specific expression. CONSTITUTION:As an average gap between electrode pads LK is set by an expression (aK is the bottom diameter of a bonding capillary; H the height of a loop; K the thickness of a ball; alpha the diameter of a bonding fine wire 14; and theta the inclination of the side face of the bonding capillary). Next, such a gap between electrode pads 12a that a bonding fine wire connecting electrode pads and electrode extraction lead makes a right angle or a near angle with an array of electrode pads is set at a minimum gap L1 that is smaller than LK and allows wire bonding. The difference between L1 and LK is added to the gap between electrode pads in a part where a bonding fine wire faces obliquely an electrode pad, thereby setting L2. |
