| 摘要 |
<p>PURPOSE:To provide an electrostatic chuck which can simply uniformize the temperature distribution of a wafer as kept on a rugged surface by utilizing electrostatic suction force. CONSTITUTION:The ruggedness of an electrostatic chuck surface is varied by making the projection area ratio smaller in the outer periphery 1B relatively outside that surface than in the center 1A relatively inside this surface, so that thermal transfer rate between wafer and the electrostatic chuck 1 may become larger in the center than in the periphery. At this time, the projection is formed 10mum-70mum high so that temperature distribution can be effectively controlled by the projection area ratio.</p> |
