发明名称
摘要 PURPOSE:To make it possible to easily scrape off and discharge heat resisting engineering plastic and to easily change over resin to general-purpose engineering plastic or general-purpose resin by a method wherein the changeover of resin is done by once changing over to low viscosity resin, the range of molding temperature of which overlaps with that of the previous resin and which contains filler such as glass fibers or the like. CONSTITUTION:After the finish of molding, the resin in a hopper 6 is discharged from a discharge hole 6a. Next, a mixture of high fluidity grade resin and glass fibers (displacement resin) is employed as low viscosity resin containing filler such as glass fibers or the like and charged in a temporary displacement resin storage device 11. Next, the action time for resin changeover, the rotational frequency of a screw, the back pressure of the screw, the temperature of a heating cylinder during the resin changing-over action and the molding temperature of a general-purpose resin, which is the aimed-at resin of the resin changeover, are set through the operating panel 20 of a controlling device 10. After that, general-purpose resin is charged in the hopper 6 and the resin changing-over action is started by the switch of the operating panel 20. Next, when the temperature of the heating cylinder 1 reaches the set temperature, a resin feeding device 13 feeds the replacement resin through a resin drop hole 14 into the interior 1a of the heating cylinder 1. At the same time, the rotation and injection of the screw 2 are repeated by the command of a screw action controlling CPU 23, resulting in easily chaning-over resin to the replacement resin.
申请公布号 JPH0446731(B2) 申请公布日期 1992.07.30
申请号 JP19860198040 申请日期 1986.08.26
申请人 MITSUBISHI HEAVY IND LTD 发明人 KUBOTA KOJI;TERAO KENICHI
分类号 B29C45/16;B29C45/17 主分类号 B29C45/16
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