| 摘要 |
PURPOSE:To minimize the warp of a board at the time of baking by bring the wavy faces of highly heat conductive plates into contact with both sides of a laminate through flat protective plates, and baking them. CONSTITUTION:In the condition that the wavy faces of the highly heat conductive plates 15 are brought into contact with both sides of the laminate 1, where a plurality of green sheets in each of which a via hole is filled up with a via filler excellent in conductivity and an inner pattern is printed are laminated and pressed, through protective plates 16 consisting of plate-shaped ceramics, those are placed on a low heat conductive baking jig 3, and also it is covered with a low heat conductive jig cover 13, and the complete laminate 1 is baked in inert gas atmosphere. The topside of the laminate is pressed by the dead weights of the protective plate 16 and the heat conductive plate 15, and by interposing a protective plate 16 between it and the wavy face of the heat conductive plate 15, the shrinkage of the laminate 1 becomes smooth, and the warp of the baked ceramic board can be minimized. |
