发明名称 SEALING DEVICE
摘要 PURPOSE:To reduce the occurrence of voids and bores at a solder sealing part and improve the strength of the solder sealing part by attaching a nozzle, where a cooling gas blowout port is provided in the same direction as the shifting of a sealing member, to the vicinity of the solder sealing part just after heating. CONSTITUTION:The solder 1, which has fused being heated by a heater 12, spreads to stop the space between a board 2 and a cap 3, and then it solidifies being cooled by the cooling gas 15 blowing out of the square nozzle 18 attached just above the board 2 being positioned at the exit of a heater box 7 and being a sealing member. By installing the square nozzle 18 near the solder sealing part at cooling of the solder 1, the cooling capacity to the solder sealing part improves. Moreover, by providing the square nozzle 18, at a plurality of places in the same direction as the shifting direction of the sealing member, with a plurality of gas blowout ports, the cooling speed of the sealing part can be increased, and the besides it can be cooled uniformly. Hereby, it becomes possible to reduce the occurrence of the voids or bores at the sealing part. The cost of the sealing part can be improved.
申请公布号 JPH04208554(A) 申请公布日期 1992.07.30
申请号 JP19900329350 申请日期 1990.11.30
申请人 HITACHI LTD 发明人 KAWAMURA KEIZO;OGURO TAKAHIRO;HAYASHIDA TETSUYA;SATO TOSHIHIKO;HATSUDA TOSHIO
分类号 B23K1/00;B23K1/008;B23K1/14;B23K101/40;H01L23/02;H05K3/34 主分类号 B23K1/00
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