发明名称 MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD
摘要 PURPOSE:To suppress haloing by forming a first blackened layer made of CuO and Cu2O, etching the layer to a predetermined thickness, and then further forming a second blackened layer enriched with the Cu2O by the second blackening. CONSTITUTION:When a circuit board for an inner layer is laminated, a circuit board for the layer which is previously degreased is first blackened to form a first blackened layer made of CuO and Cu2O, and the blackened layer is etched to a predetermined thickness. Further, a second blackened layer enriched with the Cu2O is formed by second blackening. That is, the formed blackened layer is etched until it is suitably reduced in thickness, and further the blackening is repeated. Thus, the blackened layer is enriched with the Cu2O, and the Cu2O enriched layer suppresses a haloing.
申请公布号 JPH04208596(A) 申请公布日期 1992.07.30
申请号 JP19900340572 申请日期 1990.11.30
申请人 TOPPAN PRINTING CO LTD 发明人 YOSHIDA RISABURO;SAKUMA YASUHIRO;ITO MASAHIRO;MURAKI AKIRA
分类号 H05K3/38;H05K3/46 主分类号 H05K3/38
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