| 摘要 |
<p>Thin wafers (12) of chocolate or other edible material are moulded by locating flexible mould plate (14), provided with perforations (16) corresponding to the outline of the chocolate wafers, onto a planar lower part (22), filling the perforations with liquid mass and raising of the mould plate (14) for the removal of the wafers from the perforations. The mould plate e.g. of polycarbonate, is substantially stiff in tension and compression and the perforations enlarge towards the lower part (22). The mould plate is fixed by magnetic means (32, 36) to the lower part before the removal of the wafers and the liquid mass is filled to excess into the perforations, the excess mass being subsequently wiped off the upper side of the mould plate. This method allows a mechanical filling in coating apparatus with simple, if so desired manual, removal of the wafers. Decorative printing may be transferred to the wafer from a foil (26). <IMAGE></p> |
