首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
FORGING DIE
摘要
申请公布号
SU1750833(A1)
申请公布日期
1992.07.30
申请号
SU19904788811
申请日期
1990.02.05
申请人
N-PROIZV OB "VOLGOGRADSKIJ NII TEKHNOLOGII MASHINOSTROENIYA"
发明人
FUTERMAN VITALIJ I,SU;KHOKHLOV NIKOLAJ A,SU;KOVALEV VALERIJ D,SU;SHIPOV BORIS E,SU
分类号
B21J13/02
主分类号
B21J13/02
代理机构
代理人
主权项
地址
您可能感兴趣的专利
SEMICONDUCTOR DEVICE
FLASH MEMORY STRUCTURE
SEMICONDUCTOR DEVICE
INTEGRATED CIRCUIT WITH ON CHIP PLANAR DIODE AND CMOS DEVICES
SERIES RESISTOR OVER DRAIN REGION IN HIGH VOLTAGE DEVICE
Diode-Based ESD Concept for DEMOS Protection
SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES
METHODS FOR HIGH PRECISION MICROELECTRONIC DIE INTEGRATION
WIRE BONDING METHOD AND STRUCTURE
Power Semiconductor Package with Conductive Clips
Barrier Structure for Copper Interconnect
NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
SEMICONDUCTOR DEVICE
FLEXIBLE PACKAGE-TO-SOCKET INTERPOSER
TSV WITH END CAP, METHOD AND 3D INTEGRATED CIRCUIT
Package with Embedded Heat Dissipation Features
PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPOSED BY GROOVES IN PACKAGE COMPOUND
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME