| 摘要 |
PURPOSE:To prevent the breaking of a wire between a wire and a pad to the penetration of water into a package by dividing the pad of the electrode for external leading out from the circuit made at a semiconductor chip into a plurality of places to one wire bonding part. CONSTITUTION:For the pad 1 of the electrode for external leading out from the circuit made at a semiconductor chip, the exposed face is divided in a plurality by a cover insulating film 4A. Accordingly, even if moisture penetrates along the wire, only the small pad, which has an exposed part, is corroded, and the moisture can not penetrates other small pads, which do not have exposed parts, being intercepted by the cover insulating film 4A at pad divided parts. Hereby, to the penetration of moisture into the package, the wire breaking between the wire and the pad 1 can be prevented. |
