| 摘要 |
PURPOSE:To improve heat radiation property and processability by equipping it with a base member capable of attaching an electrode terminal and an upper sealing member to be junctioned with the base member, and fixing a semiconductor chip to the metallic upper sealing member. CONSTITUTION:A semiconductor chip 10 is fixed in the recessed part on a metallic chap 12 by a low-stress mount, and the cap 12 is junctioned, to produce space, with the metallic stem 16 by the recess, and a printed board 20 is fixed onto the stem 16 by metallic paste 18. The stem 16 is provided with an aperture, which corresponds to the position of the semiconductor chip 10, and the wiring pattern 22 exposed inside the aperture 34 is electrically connected to the bonding pad of the semiconductor chip 10 by, for example, a bonding wire 36. A shell 38 is junctioned above the aperture 34, and the space generated between the cap 12 and the stem 16 is sealed. Hereby, a semiconductor package excellent in heat radiation property and processability can be gotten. |
