发明名称 |
Surface treating solutions and cleaning method. |
摘要 |
<p>A combination of a first surface treating solution comprising an inorganic or organic alkali such as ammonia or a quaternary ammonium hydroxide, hydrogen peroxide, water and a second surface treating solution of ultra-pure water, at least one of the first and second surface treating solutions containing as a complexing agent a compound having one or more phosphonic acid groups in the molecule and showing chelating ability, or an oxidized form thereof, or polyphosphoric acid or a salt thereof, is effective for making semiconductor surfaces free from harmful metallic impurities such as Fe, A l , Zn, etc.</p> |
申请公布号 |
EP0496605(A2) |
申请公布日期 |
1992.07.29 |
申请号 |
EP19920300556 |
申请日期 |
1992.01.22 |
申请人 |
WAKO PURE CHEMICAL INDUSTRIES LTD;PUREX CO.LTD. |
发明人 |
HAYASHIDA, ICHIRO,C/O TOKYO KENKYUSHO;KAKIZAWA, MASAHIKO,C/O TOKYO KENKYUSHO;UMEKITA, KENICHI,C/O TOKYO KENKYUSHO;NAWA, HIROYOSHI,C/O TOKYO KENKYUSHO;MURAOKA, HISASHI |
分类号 |
C11D7/60;C01B15/037;C11D3/36;C11D3/39;C11D7/06;C11D7/16;H01L21/304;H01L21/306 |
主分类号 |
C11D7/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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