| 摘要 |
PURPOSE:To make it possible to form a semiconductor device having an excellent heat dissipation property by connecting a hat sink made of a raw material having a heat expansion coefficient equivalent to that of a semiconductor chip with a chip side where there exist semiconductor junctions by way of a chip coat. CONSTITUTION:A heat sink 26 is fixedly mounted to a chip side of a semiconductor chip 24 where there exist junction patterns by way of a chip coat having insulating properties, such as polyimide resin. As for the quality of the heat sink 26, a raw material, such as Mo, which has a thermal expansion coefficient equivalent to that of the semiconductor chip 24, is adopted so as to reduce thermal stress against the semiconductor chip 24. To avid the contact with a wire 25, there is formed a wire escape space which is recessed on the side. Therefore, after the wire bonding is over, the heat sink 26 is connected with the chip side of the semiconductor chip 24 so that heat may be dissipated from the chip side of the semiconductor chip 24 generating a large quantity of where there exist junction patterns directly by way of the heat sink 26, which provides excellent heat dissipation property. |
