| 摘要 |
PURPOSE:To obtain a package with high isolation by connecting three conductor layers in a form of crank, and connecting semiconductor conductor devices in the conductor layer shape, respectively. CONSTITUTION:A distributed constant line 2 and a semiconductor integrated circuit 3 are soldered onto a conductor layer 1, and they are connected by a bonding wire 4. Since the conductor layer 1 is formed to be a crank shape, the distance between the input port and the output port is prolonged and a microwave signal propagating in air is reduced and the isolation is improved. Thus, the microwave propagating in air is reduced and the high isolation is attained for the package, and high density packaging is attained. |
