| 摘要 |
A new and improved electronic circuit connector and method of producing the same is provided by forming a groove on a surface of a first section of ultrasonically weldable material, inserting an elongated contact partially within the groove whereby one end of the contact protrudes out from an end of the connector, overlaying an elongated lead wire on the contact within the groove whereby the lead wire also extends beyond the connector boundary but in an opposite direction of the protruding end of the contact, fitting a second section of ultrasonically weldable material on top of the first section whereby the second section includes a protrusion shaped to interconnect with the groove of the first section, and ultrasonically welding the first and second sections together. Engaging means may be employed on the groove and corresponding protrusion to facilitate alignment of the first and second sections of material. Other embodiments of the present invention enable fabrication of multiple lead connectors and multi-layered connectors.
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