发明名称 BONDING METHOD AND DEVICE
摘要 <p>PURPOSE:To achieve a highly accurate alignment of position of two components by detecting a relative positional deviation of two components by positioning a detection device with a detection port at upper and lower parts between two components with one component being transported to upper or lower part of the other component. CONSTITUTION:By transporting one component 2 to upper or lower part of the other component, a pattern of two components 2 and 1 is detected. Then, positions of two components 2 are aligned in reference to either one parts based on the detection result, and then two parts 2 and 1 whose position is aligned are bonded. In such bonding method, while one parts 2 is transported to upper or lower portion of the other parts 1, the above detection process allows a detection device 10 with detection parts 16A and 16B on the upper and lower portions to be positioned between the above two parts 2 and 1, thus enabling a relative positional deviation between two parts 2 and 1 to be detected. For example, the above detection device 10 is mounted to an XY stage 13 which can be moved in X and Y directions.</p>
申请公布号 JPH04206746(A) 申请公布日期 1992.07.28
申请号 JP19900336610 申请日期 1990.11.30
申请人 SHINKAWA LTD 发明人 OZAWA KANJI;SONODA YUKITAKA
分类号 G01B11/24;G01B11/27;H01L21/52;H01L21/60;H01L21/68;H05K13/04 主分类号 G01B11/24
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