| 摘要 |
<p>PURPOSE:To obtain a thick-film resistance composition substance whose sheet resistance value is low and whose TCR is stable by using the following: a noble-metal powder composed of silver and palladium in a prescribed mixture ratio; and an inorganic bonding agent containing a glass frit having a specific softening point. CONSTITUTION:The following are mixed with a vehicle in which ethyl cellulose has been dissolved to terpinol: a noble-metal powder which is composed of 44 to 47wt.% of silver and 53 to 56wt.% of palladium; and an inorganic bonding- agent powder containing a glass frit whose softening point is at 750 to 900 deg.C and which is composed of 40 to 60wt.% of SiO2, 10 to 20wt.% of Al2O3, 3 to 12wt.% of B2O3, 0.5 to 5wt.% of MgO and 15 to 30wt.% of Cab. At this time, titania or alumina at 1 to 25 pts.wt. is contained in the inorganic bonding agent as required. The inorganic bonding agent contains the glass frit at 10 to 120 pts.wt. against the noble-metal powder at 100 pts.wt. Then, the mixture is printed on an alumina ceramic substrate; it is baked in a conveyor furnace; an electric current is formed. A resistive paste whose resistance value is low and whose TCR is stable is obtained. Thereby, a small-sized and high-density interconnection can be realized.</p> |
