| 摘要 |
<p>PURPOSE:To obtain a semiconductor device with an excellent moisture resistance, especially a semiconductor device which does not produce any cloudiness at a lid of a light-transmission part due to instruction of water content by enabling an airtight seal type package to consists of a cured substance of epoxy resin containing fluorine which is expressed by a specific expression. CONSTITUTION:In a semiconductor device with a semiconductor element, a lead frame, a bonding wire, and an airtight seal type package for sealing them, the above airtight sealing type package consists of a cured substance of one or two type or more epoxy resins containing fluorine which are expressed by general expressions [1]-[8] of display, where R<1> and R<2> in the expressions indicate an alkyl group with fluorine atom, R<3>-R<6> indicate hydrogen atom, chlorine atom, boron atom, lower alkyl group, or perfluoroalkyl group, and A and B indicate a group of the expression IV. Also, n in the expressions indicate 0 or a positive number; m 1-10; j 1-40; k 1-8; l 0-7; 2<k+l<8; p 1-40; q 2-200; r 0-200.</p> |
