| 摘要 |
An apparatus for disposing of a used thermal stencil master sheet, in a superior disposing efficiency and secret-retainability, and a process for disposing of the same are provided, which apparatus is provided with a stripping nail for stripping a used thermal stencil master sheet wound up on a stencil body therefrom, a waste stencil box for encasing the stripped master sheet and rolls for waste stencil for feeding the master sheet into the box, and is characterized by providing a means for heating the master sheet so that it is heat-shrinked and/or melted within the box, and which process comprises discarding the used master sheet of a thermal stencil master sheet, and heating the used master sheet so as to subject it to heat-shrinkage and/or melting.
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