首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH04206972(A)
申请公布日期
1992.07.28
申请号
JP19900339395
申请日期
1990.11.30
申请人
NEC CORP
发明人
TAKEMURA HISASHI;TASHIRO TSUTOMU
分类号
H01L29/78
主分类号
H01L29/78
代理机构
代理人
主权项
地址
您可能感兴趣的专利
FLAP DOOR MECHAMISM AND ELECTRONIC DEVICE THEREWITH
ELECTRIC MACHINE WITH ROTOR INTERIOR VENTILATION
Automatic Diagnosis or Repair for a Generator Controller
TRANSMITTER FOR TRANSMITTING WIRELESS POWER AND WIRELESS POWER TRANSMITTING SYSTEM HAVING THE SAME
MAGNETIC SHIELDING APPARATUS AND MAGNETIC SHIELDING METHOD
ADJUSTABLE WHEEL COVER FOR ALUMINUM ALLOY RIM
Vending Machine Lock with Motor Controlled Slide-Bar and Hook Mechanism and Electronic Access
Combined Power and Heating Station
VEHICLE DEBRIS SHIELD
ASSEMBLY OF AIRBAG MODULE AND STEERING WHEEL
SEALING MEMBER FOR MASTER CYLINDER
SEALING MECHANISM AND SEALING METHOD
Windback Device for a Circumferential Seal
STRUCTURE OF MOTOR-MOUNT FOR ELECTRIC VEHICLE
METHOD FOR PREPARING CARBON NANOTUBE FIBER REINFORCED WTIH CARBON PRECURSOR
MANUFACTURING METHOD AND APPARATUS FOR FRP BAR USING ROTATIONAL NOZZLE, AND NOZZLE FOR SUCH APPARATUS
INSULATED CONCRETE SLIP FORM AND METHOD OF ACCELERATING CONCRETE CURING USING SAME
ELECTRODE CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
Embedded Silver Nanomaterials into Die Backside to Enhance Package Performance and Reliability
Multi-Die Power Semiconductor Device Packaged On a Lead Frame Unit with Multiple Carrier Pins and a Metal Clip