| 摘要 |
PURPOSE:To make it possible to manufacture a multilayer board by applying an easily removable solvent to the inner surface of a hole which calls for no plating and an electroless plating solution thereto and then removing both the solvent and the non-electrolytic plating solution and then further applying electrolytic plating to the surface on which the non-electrolytic plating still remains. CONSTITUTION:The inner surface of a hole 14 which calls for no plating is coated with an etching resist film formation agent 15. Then, a non-electrolytic plating solution is injected into the hole 14, thereby forming non-electrolytic plating. After the formation of plating, the resist film formation agent 15 in the hole 14 and the non-electrolytic plating formed on the surface are separated and removed by an aqueous solution, such as HCl. Electrolytic plating is applied to the non-electrolytic plating where a thick plating layer 16 is formed, thereby forming through holes 1724 and 1746 which connect a central conductor 132 with a central conductor 134 and a central conductor 134 with a central conductor 136 respectively. |
