发明名称 MAKING METHOD FOR SEMICONDUCTOR DEVICE
摘要 <p>The method for producing a semiconductor is characterized by (a) etching a bonding pad to remove a photosensitive film, (b) treating the etched pad with an acid contg. sulfide compound i.e. NH2HSO3 to remove an aluminium oxide (Al2O3) film and a carbon compound, and (c) annealing the treated pad under the mixed gas (N2/H2) atmosphere at 400-450 deg.C to remove an oxygen. The method gives a high workability in the wire bonding process.</p>
申请公布号 KR920006094(B1) 申请公布日期 1992.07.27
申请号 KR19850008911 申请日期 1985.11.28
申请人 GOLDSTAR ELECTRON CO., LTD. 发明人 AN, DONG - JUN
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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