发明名称 PRODUCTION OF THIN FILM ELECTRONIC ELEMENT
摘要 <p>PURPOSE:To obtain a pattern in a large area in which lots of thin film electronic elements re arranged by forming the structural elements by printing with using such an ink comprising a binder and ultra fine particles which are the component of structural elements or ultra fine particles on which preliminarily charges are given. CONSTITUTION:Each structural element of the electronic device is formed by printing. By laminating the print patterns, the electronic device having laminated structural elements can be obtd. Namely, such as ink having the component corresponding to the structural element is used, for example, an ink consisting of a binder and ultra fine particles of Si, Ge, Se, Te, GaAs, and InP is used for printing to form the pattern of each structural element. By laminating these patterns, the objective thin film electronic device can be formed. Thus, a pattern in which lots of thin film electronic elements are arranged can be obtd. in a large size, which improves the productivity of the thin film electronic device.</p>
申请公布号 JPH04204920(A) 申请公布日期 1992.07.27
申请号 JP19900339633 申请日期 1990.11.30
申请人 TOPPAN PRINTING CO LTD 发明人 MURAKI AKIRA
分类号 G02F1/1343;G02F1/136;G02F1/1368;H01L21/283;H01L21/288;H01L21/336;H01L27/12;H01L29/40;H01L29/78;H01L29/786 主分类号 G02F1/1343
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