| 摘要 |
The device comprises a generally parallelepipedal housing which contains a heating element and is closed underneath by a radiant panel. The heating element is fixed to the radiant panel (6), being intimately bonded to its inside surface so as to transmit the heat it is giving off to the panel (6) by conduction. The outside face of the radiant panel (6) is made emissive by applying an absorption layer that promotes the emission of infrared radiation. The inside face is made reflective for infrared radiation. The outside face of the radiant panel (6) is rough. <IMAGE>
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