发明名称 |
APPARATUS FOR CONNECTING SEMICONDUCTOR DEVICES TO WIRING BOARDS |
摘要 |
<p>An apparatus for connecting a semiconductor device having multi-electrodes at small pitches to a wiring board in such a manner as to secure the alignment between the electrodes and the wiring patterns, the chips being secured to the wiring board with an insulating resin of a photo-setting nature. The apparatus eliminates the necessity of using heat or supersonic waves, thereby reducing equipment costs.</p> |
申请公布号 |
KR920005934(B1) |
申请公布日期 |
1992.07.24 |
申请号 |
KR19900004162 |
申请日期 |
1990.03.28 |
申请人 |
MATSUSHITA ELECTRIC IND. CO., LTD. |
发明人 |
FUJIMOTO, HIROAKI;HITADA, KENJOU;DAKESHIDA, YOSHINOBU;OTANI, GAZUYA;DAKEDA, KIMIAKI |
分类号 |
H05K13/04;(IPC1-7):H05K13/04 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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