| 摘要 |
PURPOSE:To obtain a resin molding of improved electric conductivity without detriment to its properties and without causing its discoloration by molding a mixture obtained by kneading a resin molding material with a specified complex. CONSTITUTION:An organic compound (i) having a skeleton of formula I {wherein Z is a residue of an active hydrogen, compound; Y is an active hydrogen group; 1-20C alkyl or (alkyl)aryl; m is 1-250; k is 1-12; and A is a group of formula II [wherein n is 0-25; R is 1-20C alkyl or (alkyl) aryl]} is mixed with 0.5-10wt.%, based on component (i), component (i)-soluble electrolyte salt (ii) dissolved in a solvent highly compatible with component (i), and the solvent is removed from the mixture to obtain a complex (b). A resin molding material (a) is kneaded with 1-30wt.%, based on component (a), component (b) to obtain a mixture. This mixture is molded to obtain a resin molding. |
