发明名称 |
MODIFICATION OF CONDUCTIVITY OF RESIN MOLDING |
摘要 |
PURPOSE:To obtain a resin molding of improved electric conductivity without detriment to its properties and without causing its discoloration by molding a mixture obtained by kneading a resin molding material with a specified complex. CONSTITUTION:An organic polymeric compound (i) obtained by crosslinking an organic compound having a skeleton of formula I {wherein Z is a residue of an active hydrogen compound; Y is an active hydrogen group; k is 1-12; E is a copolymer of unit of formula II [wherein n is 0-25; R is 1-20 C alkyl or aryl] with unit B comprising an alkylene oxide} is mixed with 0.5-10wt.%, based on component (i), component (i)-soluble electrolyte salt (ii) dissolved in a solvent highly compatible with the organic compound, and the solvent is removed from the mixture to obtain a complex (b). A resin molding material (a) is kneaded with 1-30wt.%, based on component (a), component (b) to obtain a mixture. This mixture is molded to obtain a resin molding. |
申请公布号 |
JPH04202230(A) |
申请公布日期 |
1992.07.23 |
申请号 |
JP19900332875 |
申请日期 |
1990.11.28 |
申请人 |
DAI ICHI KOGYO SEIYAKU CO LTD |
发明人 |
MOTOGAMI KENJI;MORI SHIGEO |
分类号 |
C08J7/06;C08G65/26;C08J3/20;C08J5/00;C08K3/00;C08K3/10;C08K5/09;C08K5/10;C08K5/16;C08L23/10;C08L71/02;C08L101/00 |
主分类号 |
C08J7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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