| 摘要 |
PURPOSE:To perform stable and high accurate lapping work throughout a long period, by mounting an abrasive surface plate with free vertical movement along a rotary shaft, generating dynamic pressure in a bottom face of the abrasive surface plate to support thrust load and thus eliminating fluctuation of the abrasive surface plate. CONSTITUTION:To the bottom face of a storage tank 12 holding accumulated abrasive liquid 11, a surface plate seat 24 is fixed with set screws 25. On the top face of the surface plate bearing seat 24, a wedge-shaped dynamic pressure generating face 26 is radially carved. An abrasive surface plate 19 is placed on a flange 27 at the lower end of a surface plate supporting member 17, and its space with the surface plate bearing seat 24 can be adjused by three gap adjusting screws 28. A pin 29 provided in the surface plate supporting member 17 and long groove 30 provided in the abrasive surface plate 19 can transmit driving rotary motion of a rotary shaft 14 to the abrasive surface plate 19 while holding free vertical movement to perform lapping work of a semiconductor wafer 22. In this way, hydraulic dynamic pressure generated between the abrasive surface plate and the surface plate plate bearing seat can support a thrust load. |
