发明名称 MODIFICATION OF CONDUCTIVITY OF RESIN MOLDING
摘要 PURPOSE:To obtain a resin molding of improved electric conductivity without detriment to its properties and without causing its discoloration by molding a mixture obtained by kneading a resin molding material with a specified complex. CONSTITUTION:An organic polymeric compound (i) obtained by crosslinking an organic compound having a skeleton of formula I{wherein Z is a residue of an active hydrogen compound; Y is an active hydrogen group; m is 1-250; k is 1-12; and A is a group of formula II [wherein n is 0-25; R is 1-20C alkyl or (alkyl)aryl} is mixed with 0.5-10wt.%, based on component (i), component (i)-soluble electrolyte salt (ii) dissolved in a solvent highly compatible with the organic compound, and the solvent is removed from the mixture to obtain a complex (b). A resin molding material (a) is kneaded with 1-30wt.%, based on component (a), component (b) to obtain a mixture. This mixture is molded to obtain a resin molding.
申请公布号 JPH04202232(A) 申请公布日期 1992.07.23
申请号 JP19900332877 申请日期 1990.11.28
申请人 DAI ICHI KOGYO SEIYAKU CO LTD 发明人 MOTOGAMI KENJI;MORI SHIGEO
分类号 C08J3/20;C08G65/26;C08G65/40;C08J5/00;C08K3/00;C08K3/10;C08K5/09;C08K5/10;C08K5/16;C08L23/10;C08L71/02;C08L101/00 主分类号 C08J3/20
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