| 摘要 |
PURPOSE:To provide the subject composition for copper-clad laminated board, etc., having high toughness, flexibility and impact resistance and containing a bisphenol A epoxy resin, a bisphenol A compound or a novolak resin as a hardener and a high-molecular weight polycarbonate as an additive. CONSTITUTION:The objective resin composition can be produced by compounding (A) a bisphenol A epoxy resin of formula (n is 0-10; m is 1; lis 0; R<1> and R<2> are glycidyl; A<1> to A<8> are H or Br) as a base resin, (B) a bisphenol A (bromide) of formula (n is 0; m is 1; l is 0; R<1> and R<2> are H; A<1> to A<8> are H or Br) or a novolak resin produced by bonding >=2 molecules of the bisphenol A (bromide) through methylene group at any of A<1> to A<8> as an epoxy resin hardener and (C) a high-molecular weight polycarbonate of formula (n is 0; m is 50-500; l is 1; B is CO; R<1> and R<2> are polymer terminal group; A<1> to A<8> are H or Br) as an additive. |
