发明名称 LASER COMPOSITE PROCESSING MACHINE
摘要 PURPOSE:To perform a punching, a tapping, and a drilling work in addition to an ordinary laser treating work by locating first and second work support means in a form where a work is supported from below, and moving the two means in a second moving direction in a form where no relative movement between a work hooking means and the work supporting means is effected. CONSTITUTION:Work support devices 15 and 20 to support a work 80 from below are divided into a front device 15 ranging from a front end part 2a to a central part 2b and a rear device 20 ranging from the central part 2b to a rear end part 2c in a state that a bottom mold unit 50 arranged to the central part 2b of a base 2 is nipped therebetween. Work supports 16a and 21a of the devices 15 and 20 are revolved and moved aside at sprockets 17a and 22a parts of the front and rear devices in a bottom mould unit moving space 28 at the central part 2b and do not enter the space 28. Thus, the unit 50 is prevented from interference with the supports 16a and 21a and can be moved in the direction of an Y-axis extending vertically to the direction of an Y-axis being the moving direction of a work carriage 10 and a work 80.
申请公布号 JPH04201141(A) 申请公布日期 1992.07.22
申请号 JP19900336812 申请日期 1990.11.30
申请人 YAMAZAKI MAZAK CORP 发明人 MIYAGAWA NAOTOMI
分类号 B23P23/04;B21D28/04;B21D28/36;B23K26/00;B23K26/02;B23K26/38 主分类号 B23P23/04
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