发明名称 THERMAL INSULATION BOARD
摘要 <p>PURPOSE:To obtain a thermal insulating board with excellent processability, cracking strength and dimensional stability as well as thermal insulating properties by laminating and adhering sheet materials consisting of a plurality of heat-resistant synthetic papers and at least a metal film through a heat-resistant adhesive layer and placing the metal film between the synthetic papers. CONSTITUTION:Sheet materials constituting a laminated body consist of a plurality of synthetic papers and at least a metal film. The synthetic paper is heat-resistant and as the raw material for the paper, polyamide resins, especially arom. polyamide resins, polyimide resins etc., with a m.p. of 200 deg.C or higher, pref. 250 deg.C or higher are used. As the metal film, e.g. an aluminum film, a copper film etc., are cited. To prepare a thermal insulating board, a plurality of synthetic papers and at least a metal film are laminated and adhered by using a heat-resistant adhesive. The metal film is placed between arbitrary synthetic papers of the laminated body to improve thereby thermal insulating properties of the laminated body in the thickness direction of the laminated body, to suppress moisture absorption properties from the surface to the inner part of the laminated body and to improve flatness thereof.</p>
申请公布号 JPH04201438(A) 申请公布日期 1992.07.22
申请号 JP19900337241 申请日期 1990.11.30
申请人 SOMAR CORP;KAWAMURA SANGIYOU KK 发明人 SAKAI TAKEO;KAWAMURA TSUNEO
分类号 B32B7/02;B29C33/30;B29C45/26;B29C45/73;B32B7/12;B32B15/08;B32B15/12 主分类号 B32B7/02
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