| 摘要 |
<p>A semiconductor device manufacturing apparatus has a heat retaining tube (8) which can be freely placed in and pulled out of a processing chamber (1) of the apparatus. When located within the processing chamber, the heat retaining tube (8) surrounds the periphery of a boat (5) with the semiconductor wafers (3) mounted thereon. After the heating process of the semiconductor wafers has been completed, the heat retaining tube (8) and the semiconductor wafers (3) are pulled out of the processing chamber (1). In this way, a difference in the temperature between the center and periphery of the semiconductor wafer can be decreased, and semiconductor devices, which has an excellent performance and which are free from crystal defects or dislocation, can thus be manufactured. <IMAGE></p> |
