ALIGNMENT METHOD FOR LED PRINT HEAD

摘要

PURPOSE:To reduce errors in alignment by a method wherein adhesive agents are printed on a rear plate at the same intervals as module base plates are arranged and the adhesive surface of the rear plate is set on a base plate arranging jig to bond the module base plate thereto. CONSTITUTION:Adhesive agents 4 are printed on a rear plate 1 in a straight line at the same intervals as module base plates 2 are arranged. After arranging the module base plates 2 with their guide holes 21 fitted over guide pins 32, the module base plate 2 is set on a base plate arranging jig 3 with the rear surface thereof facing upward. At this time, this setting is made with guide pins 31 matched in position with the guide holes 11 of the rear plate 1. The rear plate 1 is then placed on the base plate arranging jig 3 with the side of the adhesive agent 4 thereof facing downward and a pressing action is exerted thereon to effect the bonding. LED chips 5 and IC chips 6 are subsequently mounted by a chip mounting machine with reference to an alignment line X to effect a predetermined wire bonding.