| 摘要 |
PURPOSE:To give the necessary power to soldering connection and to execute safe soldering by recognizing coating solder paste quantity to the objective soldering part with picture, calculating the necessary laser beam power to melt this and executing laser beam irradiating control. CONSTITUTION:An FPIC 1 is positioned and laid and successively, a picture recognizing part 5 in a laser beam soldering apparatus recognizes the objective soldering part 6 with the picture before irradiation of the laser beam. The solder coating quantity 11 is grasped as difference of binary data between an FPIC laying object 9 without solder coating and an FPIC laying object 10 with solder coating. The grasped soldering quantity and FPIC lead size and pad size already known are added and the necessary laser beam power to soldering is calculated. Based on this, a laser beam lamp current controller 8 is controlled and the laser beam irradiates the objective soldering part 6. By this method, the soldering wettability is improved, and the development of soldering ball and burning of a print substrate are prevented, and the safe soldering is execute. |
