| 摘要 |
The invention relates to a novel method for the insertion of structural components, in particular electrical components and, in this connection, preferably chips, into depressions of a tape available on a component discharge, in which (method) the said components, in a predetermined orientation, are fed in multiple paths to a component intake and from there the first component of each path is in each instance received by a pickup slot on a transfer element rotating about a shaft and the components of each group so formed are tested and then inserted commonly into the available depressions at the component discharge when all components of the group have been found to be free of defects upon testing, and in which (method) defective components are removed from the pickup slots of the transfer element.
|
