Adhesive metallic alloys and methods of their use

摘要

A unique class of adhesive alloys and bonding methods for their use are provided which enable the user to join non-conductive materials to themselves or to electrically conductive materials. The bonding alloys have enhanced wetting properties and a melting point less than 100 DEG C. in all instances. The bonding alloys are unusual and advantageous in that they create an intimate, direct, and enduring contact between the materials while minimizing mechanical and chemical stresses.