发明名称 |
Methods for and products having self-aligned conductive pillars on interconnects |
摘要 |
Methods, and products formed by such methods, of forming a self-aligned conductive pillar (16) on an interconnect (12) on a body (10) having semiconducting surfaces. A first mask (24) defines an inverse pattern for formation of an interconnect (12). The interconnect (12) is formed by additive metallization processes. A second mask (26) is formed over portions of the first mask (24) and the interconnect (12). Sidewalls of the first mask (24) which define at least one side of side of said interconnect (12) serve to also define at least one side of said conductive pillar (16). The second mask (26) also defines at least one side of the conductive pillar (16). The conductive pillar (16) is formed by additive metal deposition processes. The conductive pillar (16) is thus self-aligned to the interconnect (12) on which it is formed.
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申请公布号 |
US5132775(A) |
申请公布日期 |
1992.07.21 |
申请号 |
US19910698252 |
申请日期 |
1991.05.06 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
BRIGHTON, JEFFREY E.;ROANE, BOBBY A. |
分类号 |
H01L21/768;H01L23/522 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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