发明名称 LASER BEAN CUTTING METHOD AND LASER BEAM CUTTING DEVICE
摘要 PURPOSE:To cut a metallic plate at a good quality by making laser beam incident to a material to be machined with an angle of advance and irradiating it vertically with high pressure gas. CONSTITUTION:The material 16 to be machined is irradiated with laser beam 12 and cut. In that case, the laser beam is made incident with an angle of advance on the material 16 to be machined. At the same time with it, the material 16 to be machined is jetted with high pressure gas nearly vertically from an auxiliary nozzle 18. In a laser beam cutting nozzle, plural auxiliary nozzles are arranged on the periphery of a main nozzle through which injection of assistant gas is performed at the same time as irradiation with laser beam. In this way, it is possible to improve a limit cutting speed and increase a cut plate thickness.
申请公布号 JPH04200888(A) 申请公布日期 1992.07.21
申请号 JP19900333060 申请日期 1990.11.29
申请人 MITSUBISHI HEAVY IND LTD 发明人 MATSUMOTO TAKERU;BEPPU SEIJI;HIRAMOTO YONEO
分类号 B23K26/00;B23K26/06;B23K26/14;B23K26/38 主分类号 B23K26/00
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