| 摘要 |
<p>PURPOSE:To enable a semiconductor device to be provided with a large number of pins by a method wherein a semiconductor device mounting plate which serves also as a heat dissipating member is provided, protruding leads are provided extending toward the mounting plate concerned from outer leads, and an intermediate wiring connector which connects the protruding leads with the semiconductor device is provided onto the plate. CONSTITUTION:A semiconductor device 5 is mounted on a semiconductor device mounting plate 2 which serves also as a heat dissipating member, and heat released from the semiconductor device 5 is effectively dissipated through the plate 2. Protruding leads 4 are provided extending to a certain extent toward the mounting plate 2 from outer leads 3 so as to reach slightly into a resin sealed part. An intermediate wiring connector 6 bonded to the element mounting plate 2 is provided with an insulating film 7, an intermediate wiring pattern 9 composed of a large number of conductor members 9a of copper foil is formed on the upside of the insulating film 7, and the outer end of the intermediate wiring pattern 9 is made to protrude outward from the peripheral edge of the film 7. By this setup, the conductive member of an intermediate wiring connector can be set just enough in thickness to ensure the bonding strength between the wiring connector and protruding leads, so that a semiconductor device can be provided with a large number of pins.</p> |
