| 摘要 |
PURPOSE:To increase the number of bonding pads without decreasing an interval between bonding pads on each row by arranging polygonal bonding pads in one or more rows parallel to respective sides of a semiconductor substrate alternately in every row. CONSTITUTION:Rows of polygonal bonding pads 1 are arranged in two rows in parallel to each side of a semiconductor substrate 2 on a periphery of the semiconductor substrate 2. Bonding pads 1a, 1b having polygonal shapes and the same area are placed so that their centers do not align with each other. That is one or more rows of the bonding pads 1 having a polygonal shape are placed in parallel with each side of the semiconductor substrate 2 alternately in every row. Thus without decreasing the area of the bonding pads and also without reducing an interval, between the bonding pads 1 in each row, the number of the bonding pads can be increased. |
