| 摘要 |
PURPOSE:To prevent indentations between nearby pads and wires and contact between nearby pads and wires by removing the surface or corner of the corner section of the pad electrodes or the protective film openings on the pad electrodes located on the chip perimeter. CONSTITUTION:The two corners of a pad 102 located on the perimeter of a chip 100 in the incoming direction of a wire 104 are cut obtusely or chamfered. When this is done, even if the incoming angle of the wire 104 is increased, there is no intersection by the wire 104 and the pad 102. Further, when the wire 4 is drawn to the pad 102 by a capillary, the wire 104 does not pass through the area around the pad 102. As a result, during external checks, it is less likely to find defects and indentations between the pad 102 and the wire 104 and contact between the pads 102 and the tail of the wire 104 can be prevented. |
