| 摘要 |
<p>PURPOSE:To prevent the deformation of a plastic film substrate, curling, film peeling, etc., and to reduce the cost and weight of the above device by forming inorg. material layers on the plastic film substrate with the thickness enough to cover the surface projecting parts of the substrate. CONSTITUTION:The inorg. material layers 2a, 2b are formed on the plastic film substrate 1 with thickness enough to cover the surface projecting parts of the plastic film substrate 1. SiO2 and Si3N4 are preferable as the inorg. material. These materials are formed at the film thickness larger than the height of the projecting parts of the plastic film substrate 1 and the more preferable thickness is <=10,000Angstrom . The thin-film laminated device which obviates the deformation of the substrate in the element production process, is light in weight and low in cost, and is free from the film peeling and curling is obtd. in this way.</p> |
