| 摘要 |
PURPOSE:To provide a solder flow stop without lowering the strength of a suspension lead by widening the width of the vicinity of the indent of the suspension lead, which becomes thin accompanying a multipin configuration, etc., so that the indent may be provided. CONSTITUTION:This is equipped with a semiconductor element 1, an island 2 of a lead frame, a plurality of electrodes 3 provided at the semiconductor element 1, a lead 4 of the lead frame, a wire 5 for connecting the electrode 3 with the lead 4, a solder material 7, a recess 8 provided at the specified part of the lead 4. And for the lead connected with the island 2, the width of the part adjacent to the island 2 is made wider by a specified value than the width of the lead 4, and a recess 8 in which solder flows is constituted in the wide part. Hereby, a suspension lead equipped with a solder flow stop, which has strength even in a multipin frame, can be provided, and a semiconductor device excellent in work efficiency can be gotten.
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