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发明名称
MOLDING RESIN FOR SEALING SEMICONDUCTOR
摘要
申请公布号
JPH04198274(A)
申请公布日期
1992.07.17
申请号
JP19900326937
申请日期
1990.11.27
申请人
MITSUBISHI ELECTRIC CORP
发明人
HIGUCHI TOKUMASA
分类号
C08K3/36;C08K3/34;C08L101/00;H01L23/29;H01L23/31
主分类号
C08K3/36
代理机构
代理人
主权项
地址
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