发明名称 SEMICONDUCTING RESIN COMPOSITION
摘要 PURPOSE:To obtain a semiconducting resin composition, excellent in mechanical characteristics, molding processability and appearance and suitable as intermediate transfer units of electrophotographic devices by blending a thermoplastic aromatic polycarbonate with a thermoplastic polyalkylene terephthalate, etc., in specific amounts. CONSTITUTION:A semiconducting resin composition is obtained by blending 100 pts.wt. total amount of (A) 60-95 pts.wt., preferably 70-80 pts.wt. thermoplastic aromatic polycarbonate (e.g. bisphenol A-based polycarbonate) and (B) 40-5 pts.wt., preferably 30-20 pts.wt. thermoplastic polyalkylene terephthalate (e.g. polyethylene terephthalate) with (C) 3-20 pts.wt., preferably 5-18 pts.wt. acetylene black.
申请公布号 JPH04198359(A) 申请公布日期 1992.07.17
申请号 JP19900322392 申请日期 1990.11.28
申请人 MITSUBISHI PETROCHEM CO LTD 发明人 TANIMOTO TOSHIHIKO;OKAMURA MICHIYA;SHIMIZU HIDETO;KANIWA TOMOHIRO
分类号 C08K3/04;C08K3/00;C08L69/00;G03G15/16;H01B1/20 主分类号 C08K3/04
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