| 摘要 |
PURPOSE:To avoid the laying of a bridge due to the oscillation, etc., during the junction step thereby enabling the title electronic circuit device to be connected without fail by a method wherein non-conductive and non-wettable obstacles are formed between adjacent connection parts. CONSTITUTION:Polyimide is formed on a substrate 2 formed into a metallized pad with Al sputter-evaporated thereon and after the formation of photoresist on the Al, the photoresist is removed leaving the regions for obstacles 6, the exposed Al is etched away and then the polyimide is removed by O2 dry-etching step using the residual Al as a mask and finally Al is etched away using mixed acid to form the plug obstacles 6. On the other hand, the obstacles 6 are also formed on the semiconductor 1 side by the same steps and then solder bumps 3 are formed on the semiconductor 1 side. Next, the semiconductor 1 thus formed is aligned with the substrate 2 to be melted down by heating step. Through these procedures, the mutual contact between the solder bumps 3 due to the collapse thereof can be avoided thereby enabling the title electronic circuit de vice to be connected without fail laying no bridge at all. |
