DICING DIE-BOND FILM

摘要

PURPOSE:To enable a semiconductor wafer to be fixed by sufficient supporting force also to be released smoothly in excellent release properties in the dicing step into chips by a method wherein the title dicing die-bond film is structured of an adhesive layer, the first and second bonding layers further to be released from the part between the first bonding layer and the adhesive layer. CONSTITUTION:A supporting substrate 1 works as a strength parent body of a dicing die-bond film while an adhesive layer 2 supports the first and second bonding layers 3, 4 for sticking a formed chip to a coated body holding excellent balance of bond and release properties. The first bonding layer 3 makes the formed chip firmly bond onto the coated body even at the low temperature not exceeding 200 deg.C while performing the thermal bonding step in high temperature bond strength together with the second bonding layer 4. On the other hand, the first bonding layer 3 displaying no bonding properties at the near normal temperature, i.e., having excellent release properties from the bonding layer so as to make the smooth mounting step feasible while the second bonding layer 4 firmly supports a semiconductor wafer by the bond properties thereof. Through these procedures, the title dicing die-bond film holding the excellent balance of the supporting force of the semiconductor wafer in the dicing step and the release properties from the bonding layer for fixing the formed chip can be manufactured.